Through Silicon through (TSV) is a key expertise for knowing three-d built-in circuits (3D ICs) for destiny high-performance and low-power platforms with small shape elements. This ebook covers either qualitative and quantitative techniques to offer insights of modeling TSV in a diverse viewpoints akin to sign integrity, strength integrity and thermal integrity. lots of the research during this e-book contains simulations, numerical modelings and measurements for verification. the writer and co-authors in every one bankruptcy have studied deep into TSV for a few years and the gathered technical know-hows and assistance for similar topics are comprehensively covered.
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